Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11275415 | Dissipating interconnection module for M.2 form factor expansion card | — | 2022-03-15 |
| 11266046 | Heatsink for multiple memory modules | Marc RAETH | 2022-03-01 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11275415 | Dissipating interconnection module for M.2 form factor expansion card | — | 2022-03-15 |
| 11266046 | Heatsink for multiple memory modules | Marc RAETH | 2022-03-01 |