Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11501974 | Electrode structure of back electrode of semiconductor substrate, method for producing the same, and sputtering target for use in producing the electrode structure | Yohei Mizuno, Chiharu Ishikura | 2022-11-15 |
| 11362493 | Locking structure, electrical connection box, and wire harness | Tatsuhiko Ikeda, Takaaki Kakimi | 2022-06-14 |
| 11305495 | Adhesive injection method and structure | Kiyoka TAKAGI, Jun Ishida, Sota KAMO, Katsuya YOSHINO | 2022-04-19 |