Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11291146 | Leadframe substrate having modulator and crack inhibiting structure and flip chip assembly using the same | Chia-Chung Wang | 2022-03-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11291146 | Leadframe substrate having modulator and crack inhibiting structure and flip chip assembly using the same | Chia-Chung Wang | 2022-03-29 |