Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11457973 | Endoscopic full thickness resection device | Michael Y. Ko, John A. Hingston, Kevin Windheuser | 2022-10-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11457973 | Endoscopic full thickness resection device | Michael Y. Ko, John A. Hingston, Kevin Windheuser | 2022-10-04 |