Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239198 | Chip bonding method and bonding device | Lili Wang, Haiwei Sun, Feng QU, Jing-Meng Liu, Chao Liu +4 more | 2022-02-01 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239198 | Chip bonding method and bonding device | Lili Wang, Haiwei Sun, Feng QU, Jing-Meng Liu, Chao Liu +4 more | 2022-02-01 |