Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11367698 | Method of bonding integrated circuit chip to display panel, and display apparatus | Hongwei Ma, Youngyik Ko, Tairong Kim, Xiangdan Dong | 2022-06-21 |
| 11228006 | Organic light-emitting diode display substrate, manufacturing method thereof, packaging structure and display device | Xiangdan Dong, Youngyik Ko, Wanli Dong | 2022-01-18 |
| 11222939 | Display panel, display device and method for manufacturing display panel | Young Yik Ko, Xiangdan Dong, Wenbao Gao, Guobo YANG, Haijun Qiu +2 more | 2022-01-11 |