Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11484911 | Bottom electrode via structures for micromachined ultrasonic transducer devices | Jianwei Liu | 2022-11-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11484911 | Bottom electrode via structures for micromachined ultrasonic transducer devices | Jianwei Liu | 2022-11-01 |