Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404329 | Device and method for on-line measurement of wafer grinding force | Fei Qin, Lixiang ZHANG, Shuai Zhao, Pei Chen, Yanwei Dai | 2022-08-02 |
| 11251106 | Packaging structure of a SiC MOSFET power module and manufacturing method thereof | Fei Qin, Shuai Zhao, Yanwei Dai, Pei Chen | 2022-02-15 |