Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217659 | Direct application additive manufacturing for conductive wafer interconnect | Matthew Barlow, Anthony M. Francis, James A. Holmes | 2022-01-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217659 | Direct application additive manufacturing for conductive wafer interconnect | Matthew Barlow, Anthony M. Francis, James A. Holmes | 2022-01-04 |