Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11399430 | Method for manufacturing circuit board | Jia-He Li | 2022-07-26 |
| 11257773 | Packaged circuit structure and method for manufacturing the same | Yong-Chao Wei, Lin Gao | 2022-02-22 |