Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488946 | Package method of a modular stacked semiconductor package | Yi-Hsin Chen, Chia-Jen Chou | 2022-11-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488946 | Package method of a modular stacked semiconductor package | Yi-Hsin Chen, Chia-Jen Chou | 2022-11-01 |