Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289446 | Multiple actuator wire bonding apparatus | Keng Yew SONG, Yue ZHANG, Zheng Yu Lin | 2022-03-29 |
| 11244444 | Method and apparatus for analyzing semiconductor wafer | Jianye SONG, Guangzhi He | 2022-02-08 |
| 11239197 | Wire bonding apparatus threading system | Keng Yew SONG, Yue ZHANG, Yao TONG | 2022-02-01 |