Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11371784 | Heat dissipation unit and heat dissipation device using same | Pai-Ling Kao, Dan-Jun Chen, Guo-Hui Li | 2022-06-28 |
| 11221162 | Roll bond plate evaporator structure | Pai-Ling Kao, Dan-Jun Chen, Guo-Hui Li | 2022-01-11 |