Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11241809 | Molding die and compression molding Method | Kazuharu Yasuda, Hideaki Ichiki, Susumu Sugano | 2022-02-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11241809 | Molding die and compression molding Method | Kazuharu Yasuda, Hideaki Ichiki, Susumu Sugano | 2022-02-08 |