Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11454759 | High-throughput manufacturing of photonic integrated circuit (PIC) waveguides using multiple exposures | Linan Jiang, Stanley Pau, Thomas L. Koch | 2022-09-27 |
| 11402752 | Fabrication of optical interconnect structures for a photonic integrated circuit | Thomas L. Koch, Stanley Pau, Nasser Peyghambarian | 2022-08-02 |
| 11327225 | Optical printed circuit board with polymer array stitch | Thomas L. Koch, Stanley Pau, Nasser Peyghambarian | 2022-05-10 |
| 11275208 | Fabrication of polymer waveguide interconnect between chips with a gap and/or step | Linan Jiang, Stanley Pau | 2022-03-15 |