Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11369966 | Layered structure for improved sealing of microwell arrays | Clifford L. Anderson, Jacob Messner, Laimonas Kelbauskas, Benjamin Ueberroth, Yanqing Tian +1 more | 2022-06-28 |