Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309439 | Package structure for semiconductor device, and semiconductor device | Yao-Hung Liu, Jun Li, Jing Zhao, Jing Sun, Bin Liang +1 more | 2022-04-19 |
| 11217448 | Methods for reducing transfer pattern defects in a semiconductor device | Regina Freed, Steven R. Sherman, Nadine Alexis | 2022-01-04 |