Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11519720 | Depth profiling of semiconductor structures using picosecond ultrasonics | Ori Golani | 2022-12-06 |
| 11250560 | Methods and systems for expediting multi-perspective wafer analysis | Doron Korngut | 2022-02-15 |