Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302647 | Semiconductor device package including conductive layers as shielding and method of manufacturing the same | Ming-Hung Chen, Hui-Ping JIAN | 2022-04-12 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302647 | Semiconductor device package including conductive layers as shielding and method of manufacturing the same | Ming-Hung Chen, Hui-Ping JIAN | 2022-04-12 |