Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11428733 | On-die virtual probes (ODVP) for integrated circuitries | Yanran Chen, Edward C. Priest, Hing Y. To | 2022-08-30 |
| 11270977 | Power delivery network for active-on-active stacked integrated circuits | Praful Jain, Steven P. Young, Brian C. Gaide | 2022-03-08 |