Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309222 | Semiconductor chip with solder cap probe test pads | Lei Fu, Milind S. Bhagavat | 2022-04-19 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309222 | Semiconductor chip with solder cap probe test pads | Lei Fu, Milind S. Bhagavat | 2022-04-19 |