Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11498773 | Material layered conveying device based on disassembly line | Zeqiang ZHANG, Yanqing Zeng, Silu Liu, Dan Ji, Xiaoyue FANG | 2022-11-15 |
| 11494321 | State buffer memloc reshaping | Yunxuan Yu, Qingrui Liu | 2022-11-08 |
| 11461662 | Compilation time reduction for memory and compute bound neural networks | Randy Renfu Huang, Richard John Heaton | 2022-10-04 |
| 11373024 | Circuit simulation based on a high-level language circuit specification | Sahil Goyal, Mahesh Attarde, Amit Kasat | 2022-06-28 |