Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11407553 | Packaging structure with resilient positioning flaps | Pin-Ying Wu, Hsin-Yi Chang | 2022-08-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11407553 | Packaging structure with resilient positioning flaps | Pin-Ying Wu, Hsin-Yi Chang | 2022-08-09 |