Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11454666 | Thermal test head for an integrated circuit device | See Jean Chan, Yao Kun Leonard Mak, MuralliKrishna Govindandhanasekaran | 2022-09-27 |
| 11378615 | Thermal test head for an integrated circuit device | See Jean Chan, Yao Kun Leonard Mak, MuralliKrishna Govindandhanasekaran | 2022-07-05 |