Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495511 | Semiconductor package structure and method for manufacturing the same | Lu-Ming Lai, Ying-Chung Chen | 2022-11-08 |
| 11440215 | Method of making wooden board assembly | — | 2022-09-13 |
| 11430906 | Optical device including lid having first and second cavity with inclined sidewalls | Chang Chin Tsai, Hsun-Wei Chan | 2022-08-30 |
| 11410915 | Semiconductor package structure including an encapsulant having a cavity exposing an interposer | Chang Chin Tsai | 2022-08-09 |