Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296025 | Interconnection structure and sensor package | Hsun-Wei Chan | 2022-04-05 |
| 11276720 | Optical package | Lu-Ming Lai, Chia-Yun Hsu | 2022-03-15 |
| 11276806 | Semiconductor device package and method for manufacturing the same | Yi Wen Chiang, Kuang-Hsiung Chen, Lu-Ming Lai, Hsun-Wei Chan, Hsin-Ying Ho | 2022-03-15 |
| 11255524 | Light emitting device | Chi-Chih Pu, Chen-Hong Lee, Shih-Yu Yeh, Wei-Kang Cheng, Shyi-Ming Pan +4 more | 2022-02-22 |