Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11535509 | Semiconductor package structure and method for manufacturing the same | Wei Liu, Lu-Ming Lai | 2022-12-27 |
| 11437292 | Semiconductor package device and method of manufacturing the same | Wei Liu, Lu-Ming Lai | 2022-09-06 |
| 11427466 | Semiconductor package structure and method for manufacturing the same | Wei Liu, Lu-Ming Lai | 2022-08-30 |