Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239178 | Semiconductor package structures and methods of manufacturing the same | Chanyuan Liu, Kuo-Hsien Liao, Alex Chi Keung Chan, Christophe Zinck | 2022-02-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239178 | Semiconductor package structures and methods of manufacturing the same | Chanyuan Liu, Kuo-Hsien Liao, Alex Chi Keung Chan, Christophe Zinck | 2022-02-01 |