Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404799 | Semiconductor device package and method of manufacturing the same | Ting Ruei Chen | 2022-08-02 |
| 11362049 | Semiconductor device package | Yi Ding | 2022-06-14 |
| 11296001 | Semiconductor device package and method of manufacturing the same | Yi Ding | 2022-04-05 |
| 11217509 | Semiconductor package structure | Jyun-Chi Jhan | 2022-01-04 |