Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11233022 | Electrical connection placement of semiconductor device package and method of manufacturing the same | Chih-Cheng Lee | 2022-01-25 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11233022 | Electrical connection placement of semiconductor device package and method of manufacturing the same | Chih-Cheng Lee | 2022-01-25 |