Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437247 | Semiconductor package structure and method for manufacturing the same | Kay Stefan Essig, Jean-Marc Yannou | 2022-09-06 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437247 | Semiconductor package structure and method for manufacturing the same | Kay Stefan Essig, Jean-Marc Yannou | 2022-09-06 |