Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D955383 | Computer host | Tsun-Chih Yang | 2022-06-21 |
| 11362055 | Bump structure of the semiconductor package | Chih-Yen Su | 2022-06-14 |
| 11302539 | Semiconductor packaging structure and method for packaging semiconductor device | Tsung-Han Chiang | 2022-04-12 |