Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469167 | Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same | Sungjin Kim, Jincheol KIM | 2022-10-11 |
| 11437308 | Packaging glass substrate for semiconductor, a packaging substrate for semiconductor, and a semiconductor apparatus | Sungjin Kim, Jincheol KIM | 2022-09-06 |