Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11518914 | Pressure sensitive adhesive assembly comprising filler material | Jan Heimink, Jan D. Forster, Jan U. Wieneke, Frank Kuester, Siegfried R. Goeb +4 more | 2022-12-06 |
| 11332648 | Pressure sensitive adhesive assembly comprising thermoplastic filler material | Jan Heimink, Jan D. Forster | 2022-05-17 |
| 11267220 | Multilayer pressure-sensitive adhesive assembly | Doreen Eckhardt, Regina Sikora, Jan U. Wieneke, Jan D. Forster, Frank Kuester | 2022-03-08 |