Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10998701 | Wire bonding method and bonded wire | Tomoya Sato, Hiroshi Aoki, Naoki Ito | 2021-05-04 |
| 10886684 | Bonding method for conductor of electric wire and electric wire | Tomoya Sato, Kazuhide Takahashi, Naoki Ito | 2021-01-05 |