Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133290 | Chip package structure with stacked chips and manufacturing method thereof | Xinru Zeng, Houde Zhou | 2021-09-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133290 | Chip package structure with stacked chips and manufacturing method thereof | Xinru Zeng, Houde Zhou | 2021-09-28 |