Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127723 | Method for mass transfer of micro semiconductor elements | Zhibai Zhong, Chia-En Lee, Jinjian Zheng, Jiansen ZHENG, Junyong Kang | 2021-09-21 |
| 11127886 | Flip-chip LED with barrier structure | Anhe HE, Su-Hui Lin, Jiansen ZHENG, Kangwei Peng, Xiaoxiong LIN | 2021-09-21 |
| 11101239 | Process for packaging component | Zhibai Zhong, Chia-En Lee, Jinjian Zheng, Lixun Yang, Junyong Kang | 2021-08-24 |
| 11043613 | Light emitting diode device and method for manufacturing the same | Zhibai Zhong, Jinjian Zheng, Lixun Yang, Chia-En Lee, Junyong Kang | 2021-06-22 |
| 11005008 | Method for manufacturing light emitting device | Senpeng HUANG, Zhen-Duan Lin, Weng-Tack WONG, Junpeng SHI, Shunyi CHEN +1 more | 2021-05-11 |
| 10916458 | Transfer head for transferring micro element and transferring method of micro element | Jiansen ZHENG, Xiaojuan Shao, Kechuang Lin | 2021-02-09 |