Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11135669 | Method and device for a high temperature vacuum-safe solder resist utilizing laser ablation of solderable surfaces for an electronic module assembly | Jennifer Stabach, Chad B. O'Neal | 2021-10-05 |
| 11069640 | Package for power electronics | Daniel Martin, Jennifer Stabach | 2021-07-20 |
| 10917992 | High power multilayer module having low inductance and fast switching for paralleling power devices | Matthew Feurtado, Daniel Martin, Alexander Lostetter | 2021-02-09 |
| D909310 | Power module | Sayan Seal, Zachary Cole, Jennifer Stabach, Brandon Passmore, Ty R. McNutt +1 more | 2021-02-02 |