Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094673 | Stacked die package with curved spacer | Kuan-Cheng Chen, Jing-Wei Hsu | 2021-08-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11094673 | Stacked die package with curved spacer | Kuan-Cheng Chen, Jing-Wei Hsu | 2021-08-17 |