Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11187594 | Bonded assembly with integrated temperature sensing in bond layer | John Bergen | 2021-11-30 |
| 11041766 | Bonded assembly with integrated temperature sensing in bond layer | John Bergen | 2021-06-22 |