Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11111435 | Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography | Matthias Stender, Bradley J. Brennan | 2021-09-07 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11111435 | Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography | Matthias Stender, Bradley J. Brennan | 2021-09-07 |