Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139233 | Cavity wall structure for semiconductor packaging | Hua Tan, Wilson Poh Leng Ong, Kriangsak Sae Le, Saravuth Sirinorakul, Somsak Phukronghin | 2021-10-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139233 | Cavity wall structure for semiconductor packaging | Hua Tan, Wilson Poh Leng Ong, Kriangsak Sae Le, Saravuth Sirinorakul, Somsak Phukronghin | 2021-10-05 |