Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145575 | Conductive bonding layer with spacers between a package substrate and chip | Tanawan Chaowasakoo, Hua Tan, Thanawat Jaengkrajarng | 2021-10-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145575 | Conductive bonding layer with spacers between a package substrate and chip | Tanawan Chaowasakoo, Hua Tan, Thanawat Jaengkrajarng | 2021-10-12 |