Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11147156 | Composite member, heat radiation member, semiconductor device, and method of manufacturing composite member | Isao Iwayama, Shigeki Koyama, Yuta Inoue, Hiroyuki Kontani, Takehisa Yamamoto | 2021-10-12 |
| 10927232 | Polyamide resin composition, method for producing polyamide resin composition, and molded article | Tomoyo KAWAMURA, Yasukazu Shikano, Katsushi Watanabe | 2021-02-23 |
| 10882676 | Paper barrier material | Yuri OISHI, Masatsugu Kato, Masaaki Fukunaga, Akio Miyajima, Hiroshi Koyamoto | 2021-01-05 |