Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211340 | Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding | Chung-Che Tsai | 2021-12-28 |
| 10923435 | Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance | Chung-Che Tsai | 2021-02-16 |
| 10896880 | Semiconductor package with in-package compartmental shielding and fabrication method thereof | Chung-Che Tsai | 2021-01-19 |