Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011525 | Landing pad structure and method of manufacturing the same | Keng-Ping Lin, Tetsuharu Kurokawa, Tzu-Ming Ou Yang | 2021-05-18 |
| 10985262 | Semiconductor structure and manufacturing method thereof | Keng-Ping Lin, Tzu-Ming Ou Yang, Tetsuharu Kurokawa | 2021-04-20 |