Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10978391 | Connection structure of semiconductor device and manufacturing method thereof | Chen-Yi Weng, Shih-Che Huang, Chih-Sheng Chang | 2021-04-13 | $1,335,000 |
| 10892235 | Die seal ring and manufacturing method thereof | Shih-Che Huang, Shih-Hsien Chen, Chih-Sheng Chang | 2021-01-12 | $2,054,000 |