Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171170 | Image sensor package with flexible printed circuits | Yuta Momiuchi, Yuji Takaoka, Kiyohisa Tanaka, Eiichirou Kishida, Emi Nishioka +1 more | 2021-11-09 |
| 11015234 | Aluminum alloy cladding material for heat exchanger | Tomohiro Shoji, Toshikazu Tanaka, Hirokazu Tanaka | 2021-05-25 |