Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031317 | Direct bonded metal substrates with encapsulated phase change materials and electronic assemblies incorporating the same | Shailesh N. Joshi | 2021-06-08 |
| 10945333 | Thermal management assemblies having cooling channels within electrically insulated posts for cooling electronic assemblies | Shailesh N. Joshi, Shohei Suenaga | 2021-03-09 |
| 10896865 | Power electronics modules including an integrated cooling channel extending through an electrically-conductive substrate | Shailesh N. Joshi, Naoya Take, Ercan Mehmet Dede | 2021-01-19 |