MI

Masakazu Ishikawa

LI Lintec: 1 patents #4 of 25Top 20%
📍 Hiroshima, JP: #5 of 11 inventorsTop 50%
Overall (2021): #349,443 of 548,734Top 65%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11007722 Dielectric-heating bonding film and joining method using dielectric-heating bonding film Tatsuya Izumi 2021-05-18